{"product_id":"chip-heating-platform-for-glue-removing-2s-ycs","title":"Chip Heating Platform For Glue Removing 2S (YCS)","description":"\u003cul class=\"description\"\u003e\r\n    \u003cli\u003eThe YCS 2S Chip Heating Platform is designed for mobile phone and iPhone IC glue removal, providing safe and efficient heating for chip debonding and repair work.\u003c\/li\u003e\r\n    \u003cli\u003eComparable to the MaAnt SL-2 CPU Chip Glue Heating Removal Station, this platform supports IC chip heating, glue softening, and preheating for improved reballing and desoldering results.\u003c\/li\u003e\r\n    \u003cli\u003eIdeal for removing hard glue from mobile phone motherboard IC chips and preparing BGA chips for repair or reballing.\u003c\/li\u003e\r\n    \u003cli\u003eFeatures precise temperature control for targeted heating, ensuring safer and more effective glue removal without damaging components.\u003c\/li\u003e\r\n    \u003cli\u003eDurable, compact, and portable design makes it suitable for various repair scenarios and easy to carry between workstations.\u003c\/li\u003e\r\n    \u003cli\u003eUser-friendly operation helps technicians work more efficiently, especially during IC chip manipulation, soldering, and board-level repair tasks.\u003c\/li\u003e\r\n    \u003cli\u003eNote: The original YCS 2S CPU Chip Glue Heating Platform is discontinued; an alternative option is the MaAnt SL-2 Heating Removal Station.\u003c\/li\u003e\r\n\u003c\/ul\u003e","brand":"YCS","offers":[{"title":"Default Title","offer_id":47713736655066,"sku":"107182117218","price":17.95,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0580\/5159\/2366\/files\/1766028929-69437681208a4.webp?v=1774698131","url":"https:\/\/glcellphoneparts.com\/products\/chip-heating-platform-for-glue-removing-2s-ycs","provider":"GLCellPhoneParts","version":"1.0","type":"link"}