SKU: 107182117236

DB02 Spudger Blade Set For Phone CPU NAND IC Glue Removal (YCS)

DB02 Spudger Blade Set For Phone CPU NAND IC Glue Removal (YCS)

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The YCS DB02 Multi-Function Spudger Blade Set is designed for mobile phone CPU, NAND Flash, and IC chip glue removal,... Read more

$10.03

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    • Shipped today? Order within: Jun 04, 2026 17:00:00 -0400
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    • No hassle returns on undamaged products
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    Returns & Delivery

    When will my order be delivered?

    We ship worldwide. Your order will be packaged really carefully and delivered wherever you want. Delivery takes between 2-4 business days. You will receive an e-mail after ordering with more information about the delivery.

    Can I return my product?

    Orders can be returned or exchanged within 30 days of receiving the parcel, providing they are in original resalable condition.

    What can I do if my item (or part of it) is damaged?

    We work hard to deliver your items without damage. Orders can be returned or exchanged within 30 days of receiving the parcel, providing they are in original resalable condition.

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