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Best Selling Products
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LCD Display Screen (Big) For DJI Osmo Action 5 Pro Camera
LCD Display Screen (Big) For DJI Osmo Action 5 Pro Camera
$65.68
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Front small LCD Display Screen for DJI Osmo Action 5 Pro Camera
Front small LCD Display Screen for DJI Osmo Action 5 Pro Camera
$31.70
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LCD Display Combo Smart Controller Digitizer Assembly For DJI RC 2
LCD Display Combo Smart Controller Digitizer Assembly For DJI RC 2
$16.22
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LCD Display Touch Screen For DJI Osmo Pocket 3 Camera
LCD Display Touch Screen For DJI Osmo Pocket 3 Camera
$84.89
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LCD Display Screen Assembly Action Camera For Insta360 X4
LCD Display Screen Assembly Action Camera For Insta360 X4
$46.19
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LCD Display Touch Screen With Frame For GoPro Hero 9 / 10 / 11 / 13
LCD Display Touch Screen With Frame For GoPro Hero 9 / 10 / 11 / 13
$35.44
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LCD Assembly Without Frame For Samsung Galaxy Tab S10 Lite 10.9" (X400 / X406) (2025) (Refurbished) (Black)
LCD Assembly Without Frame For Samsung Galaxy Tab S10 Lite 10.9" (X400 / X406) (2025) (Refurbished) (Black)
$114.44
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LCD Assembly Without Frame For Galaxy Tab A11 8.7" (X133) (2025) (WiFi Version) (Refurbished) (Black)
LCD Assembly Without Frame For Galaxy Tab A11 8.7" (X133) (2025) (WiFi Version) (Refurbished) (Black)
$17.06
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SLD01 Strong Magnetic Chip Positioning Tin Pad (YCS)
Strong magnetic base securely holds IC chips, stencils and small components in place during reballing and tinning Designed for precise chip positioning to improve accuracy and consistency in microsoldering work Ideal for BGA ICs and other small packages used in mobile phone, tablet and motherboard repair Flat work surface helps keep solder paste and tin distribution even across chip pads Reusable and durable construction suitable for daily use in professional repair labs YCS SLD01 model compatible with a wide range of common reballing and chip repair setups
$2.51
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D01 Multi-Function Repair Power Cable 10in1 For iPhone 6 - 16 Pro Max (YCS)
10in1 multi-function repair cable designed for powering and activating iPhone 6 through 16 Pro Max logic boards Supports quick boot testing, power-on activation and current draw diagnostics Provides stable and reliable voltage delivery for accurate motherboard troubleshooting Ideal for repair benches working on power-related faults and board-level repair Reinforced cable structure ensures durability for daily professional use Compatible with most DC power supplies and standard iPhone repair workflows
$13.13
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JGB 10in1 Repair Knife Handle Set (YCS)
The YCS Tools JGB 10-in-1 Multi-Function Knife Handle Set is designed for precise mobile phone repair tasks, including glue removal, chip separation, IC cleaning, circuit cutting, and board-level disassembly. Ideal for back glass glue removal, motherboard CPU delamination, BGA chip removal, PCB cleaning, and other detailed repair applications. Features a cross-shaped stable chuck with an anti-slip mesh design for secure and accurate blade positioning. Equipped with sharp and durable precision blades built for long-term use. Kit includes: 2 handles, 6 blades, and 2 cleaning brushes. Packaging size: 132 × 82 × 15 mm; weight approximately 60 g.
$7.69
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6 In 1 TP01 Damage-free Blu-ray Lens Sticker (328 Pack) (YCS)
The YCS PT01 Mobile Phone Lens Repair Protection Sticker Set includes 5mm, 6.5mm, 8mm, 10mm, 12mm, and 13.5mm size stickers designed to protect mobile phone and iPhone camera lenses, infrared modules, Face ID components, and more during repair. The center of each sticker contains no glue, ensuring damage-free protection without affecting blue light transmission. Easy to apply and remove with no residue, preventing marks or damage on delicate components. Helps prevent dust from entering sensitive areas during repair work, improving repair cleanliness and precision. Professional repair-grade design optimized for technicians working on camera, infrared, and facial recognition modules. Set Includes: 80pcs 5mm, 68pcs 6.5mm, 56pcs 8mm, 48pcs 10mm, 40pcs 12mm, and 36pcs 13.5mm stickers.
$4.25
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Chip Heating Platform For Glue Removing 2S (YCS)
The YCS 2S Chip Heating Platform is designed for mobile phone and iPhone IC glue removal, providing safe and efficient heating for chip debonding and repair work. Comparable to the MaAnt SL-2 CPU Chip Glue Heating Removal Station, this platform supports IC chip heating, glue softening, and preheating for improved reballing and desoldering results. Ideal for removing hard glue from mobile phone motherboard IC chips and preparing BGA chips for repair or reballing. Features precise temperature control for targeted heating, ensuring safer and more effective glue removal without damaging components. Durable, compact, and portable design makes it suitable for various repair scenarios and easy to carry between workstations. User-friendly operation helps technicians work more efficiently, especially during IC chip manipulation, soldering, and board-level repair tasks. Note: The original YCS 2S CPU Chip Glue Heating Platform is discontinued; an alternative option is the MaAnt SL-2 Heating Removal Station.
$17.95
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C210-K Knife 120W Soldering Iron Tip For T210 T26 Handles (YCS)
The YCS C210-K Knife 120W Soldering Iron Tip is designed for precision board-level repair and is compatible with T210 and T26 soldering station handles. Features a knife-type blade ideal for cutting, scraping, separating, and soldering in tight or delicate areas. High-power 120W design ensures rapid heating, stable temperature recovery, and improved work efficiency. Made from high-quality materials that provide strong durability, long lifespan, and consistent thermal conductivity. Perfect for mobile phone motherboard repair, IC removal, micro-soldering, and professional electronics work.
$7.88
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Solder Wire (0.4MM High Purity) (50g) (YCS)
0.4mm high purity solder wire designed for precision mobile phone, tablet, and electronics repair. Fine diameter is ideal for SMD components, micro-soldering, and detailed board-level work. Provides smooth melting, stable wetting, and clean solder joints for professional results. Suitable for use with standard soldering stations and microsoldering setups. 50g spool size is convenient for daily repair use while remaining compact for workbench storage.
$2.32
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Quick-Release Polishing Pen Max Vigorous Model (YCS)
The YCS 2nd Gen Electric Polishing and Grinding Pen is designed for electronic and mobile phone repair, including motherboard CPU work, chip grinding, IC drilling, screen removal, and glue cleaning tasks. Equipped with a Type-C rechargeable design featuring a built-in battery, five adjustable speed levels, and indicator lights to display operating status. Powered by a strong and stable motor that delivers consistent performance for a wide range of repair applications. Suitable for mobile phone repair, CPU and IC polishing, jade finishing, metal work, beeswax shaping, wood carving, ceramics, PCB work, and epoxy board processing. Includes seven versatile polishing and grinding heads, offering durability and multi-purpose functionality in a compact and lightweight tool. Quick-release mechanism allows easy replacement of grinding heads and self-calibration for improved efficiency. Uses a Type-C charging port; charging cable not included with the device. Package includes 7 grinding heads: 1 × K-pin 1.0 for slotting tail-plug screws, 2 × K-pin 4.0 for shield cutting and chip grinding, 4 × D-needle 0.1 for motherboard and IC chip grinding.
$18.53
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CP01 Mobile / Tablet Screen Repair Heating Pad LCD Separator (220V / EU Version) (YCS)
The YCS CP01 Heating Platform is designed for LCD screen and back cover separation, offering rapid and precise heating to safely soften adhesive during mobile phone disassembly. Features a built-in camera protection hole that avoids direct heat on sensitive camera areas, ensuring safer operation. Made with flexible heating material that distributes heat evenly, allowing glue to soften quicker for easier screen and back cover removal. Improves repair efficiency by reducing the risk of screen breakage and making disassembly safer and more controlled. Power: 80W–150W (Max); Voltage: AC100–240V 50/60Hz; Temperature Range: 30–120°C. Instructions: Preheat front side at 60°C for ~2 minutes, then heat the back side for ~2 minutes. Adjust heating time or temperature until adhesive softens. After softening, turn off heating and use residual heat for disassembly. Safety Notes: Keep away from water, use the original power plug, avoid placing on glass surfaces, do not bend the heating plate, and do not use it as an electric blanket.
$43.36
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Mr.Yang No 1 Smart Curve BGA Hot Air Rework Station (110V / North American) (YCS)
The YCS Mr Yang No 1 1400W Hot Air Rework Station is designed for mobile phone motherboard CPU and BGA chip soldering, desoldering, and professional board-level repair. Features digital display curve mode, large chip mode, and small chip mode for precise temperature management during complex rework tasks. Delivers fast heating and accurate temperature control through its high-power heating element, ensuring stable and efficient operation. Equipped with a spiral air outlet that provides uniform airflow distribution for consistent heating across components. Includes automatic sensing and smart sleep mode—automatically cools when placed on the stand and reheats instantly when picked up. Comes with four interchangeable nozzles (10mm, 5mm, 6mm, 8mm) to support various chip sizes and repair requirements. Upgraded curve temperature control allows customizable heat curve settings and an intuitive user interface for advanced technicians. Specifications: 1400W max power, AC 110V (North America only), packaging size 288 × 281 × 180 mm, gross weight 2.5 kg.
$165.82
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M.Y S1-160W Digital Soldering Station For T210 T115 T245 Handles (110V / North American) (YCS)
The YCS S1 Series Digital Soldering Station is designed for precision PCB, SMD, and BGA soldering and desoldering, compatible with T245, T210, and T115 handles for plug-and-play performance. Features rapid 2-second heating and 1-second temperature recovery for high-efficiency repair work. Equipped with automatic sleep mode for safety and energy saving, along with a wired handle and split-unit design for better heat management. Four-segment memory display allows quick switching between preset temperature modes for different soldering tasks. Adjustable bracket design accommodates different working angles to meet the needs of mobile phone repair and PCB assembly. The S1-160W version offers higher power performance, making it ideal for heavy-duty soldering, BGA work, and demanding microsoldering tasks. Specifications (S1-160W): Model YCS S1-160W Automatic Sleep Soldering Station, compatible with C245/C210/C115 tips, packaged in box, 110V North America only.
$117.38
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S-PK High Precision Cutter (YCS)
The YCS S-PK High Precision Cutter Pliers are designed for mobile phone, electronics, and EDC repair, providing accurate cutting performance for fine work. Ideal for trimming copper wire, iron wire, small cables, shield can tabs, and other delicate components used in industrial and electronic applications. High-precision cutting edges deliver clean, smooth cuts, reducing the risk of damage to surrounding parts. The 5-inch compact design with ergonomic grips helps reduce hand fatigue, making it suitable for long repair sessions and detailed work. Durable construction ensures reliable performance and long service life in professional repair environments. Package includes: 1 × YCS S-PK High Precision Cutter Pliers.
$5.21
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P03 H03 Pro Universal Phone PCB Holder CPU IC Soldering Fixture (YCS)
The YCS P03 H03 Pro Universal Phone PCB Holder is designed for secure clamping of mobile phone motherboards and IC areas during soldering, reballing, and CPU/IC replacement. Supports a wide range of phone PCBs with adjustable clamps, making it suitable for most smartphone logic boards and small electronic boards. Provides a stable, non-slip working platform that helps prevent movement while soldering, grinding, reballing, or cleaning glue around IC chips. Heat-resistant structure is suitable for use with hot air guns and soldering stations during BGA and CPU repair. Ideal for professional mobile phone repair technicians performing CPU, NAND, PMIC, and other high-precision IC soldering work.
$17.40
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DB02 Spudger Blade Set For Phone CPU NAND IC Glue Removal (YCS)
The YCS DB02 Multi-Function Spudger Blade Set is designed for mobile phone CPU, NAND Flash, and IC chip glue removal, providing precision and control during motherboard and board-level repair work. Includes a non-slip textured handle that offers a stable grip for safe scraping, lifting, and glue removal around delicate components. Equipped with strong, durable blades suitable for removing hard glue, underfill, and residue found around BGA chips. Comes in a premium metal storage case that is sturdy, portable, and convenient for technicians who work on the go. The 9-in-1 kit includes three 9G handles and six interchangeable blades to support various disassembly and repair needs. Lightweight design reduces operator fatigue and improves overall repair efficiency during long work sessions. Suitable for multiple repair scenarios, including mobile phones, tablets, electronic circuits, and other digital device repairs. Specifications: Model YCS DB02; product size 140 × 8 mm; packaging size 60 × 175 × 20 mm. Package includes: 1 × metal case, 3 × 9G handles, 6 × blades.
$10.03
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CPU Protection Platform (YCS)
Protective platform designed to secure CPU and major IC chips during soldering and rework Prevents accidental damage to surrounding components while performing high-heat operations Stable structure helps maintain chip alignment and reduces risk of board flexing Ideal for reballing, chip replacement, and precision microsoldering work Durable heat-resistant material suitable for professional repair environments YCS platform compatible with common mobile, tablet and motherboard IC sizes
$11.58
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No.1 Welding Fluid 5CC (YCS)
YCS Number One No-Clean Flux Solder Oil is designed for mobile phone motherboard repair and precision microsoldering work. Provides excellent solder wetting and enhances heat transfer to improve the efficiency of soldering, desoldering, and reballing. No-clean formula leaves minimal residue, reducing the need for extensive cleaning after repairs. Ideal for CPU, NAND, PMIC, baseband, and other IC chip soldering tasks where stable and reliable flux performance is required. Helps prevent oxidation during heating and supports cleaner, stronger solder joints on delicate PCB components. Suitable for mobile phone repair, tablet repair, computer board repair, and general electronics microsoldering.
$1.62